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RCLAMP1851ZATFT - SEMTECH

Description: ESD Suppressors / TVS Diodes RCLAMP1851ZATFT

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PCB Footprints
RCLAMP1851ZATFT - SEMTECH PCB footprint - Other - Other - RCLAMP1851ZATFT-3
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3D Models
RCLAMP1851ZATFT - SEMTECH  - 3D model - Other - RCLAMP1851ZATFT-3
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RCLAMP1851ZATFT Details

  • Manufacturer Part Number:

    RCLAMP1851ZATFT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Semtech Corporation

  • YTEOL:

    6.2

  • Breakdown Voltage-Nom:

    22.5 V

  • Clamping Voltage-Max:

    5.5 V

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Rep Pk Reverse Voltage-Max:

    18 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    NICKEL GOLD

RCLAMP1851ZATFT Frequently Asked Questions (FAQs)

  • A good PCB layout for the RCLAMP1851ZATFT involves keeping the input and output traces short and wide, using a solid ground plane, and placing the device close to the protected circuit. Additionally, it's recommended to use a common ground plane for the input and output signals.
  • The value of the external capacitor (C1) depends on the specific application and the desired level of ESD protection. A general guideline is to use a capacitor with a value between 1nF to 10nF. A larger capacitor value provides better ESD protection but increases the device's response time.
  • The RCLAMP1851ZATFT is rated for operation over a temperature range of -40°C to +125°C. However, it's recommended to derate the device's performance at extreme temperatures.
  • Yes, the RCLAMP1851ZATFT is suitable for protecting high-speed data lines, such as USB, HDMI, and Ethernet. However, it's essential to ensure that the device's capacitance and series resistance do not affect the signal integrity.
  • To ensure proper soldering, follow the recommended soldering profile, use a solder with a melting point below 260°C, and avoid applying excessive heat or force to the device. Additionally, inspect the solder joints for any defects or cold solder joints.

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