2.60 X 2.60 MM, 0.60 MM HEIGHT, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, SLP2626P10, 10 PIN
Pin Count:
10
Country Of Origin:
Mainland China
ECCN Code:
EAR99
HTS Code:
8541.10.00.50
Factory Lead Time:
13 Weeks
Manufacturer:
Semtech Corporation
YTEOL:
6.93
Additional Feature:
LOW CAPACITANCE
Clamping Voltage-Max:
18 V
Configuration:
SINGLE
Diode Element Material:
SILICON
Diode Type:
TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 Code:
S-PDSO-N10
JESD-609 Code:
e4
Moisture Sensitivity Level:
1
Non-rep Peak Rev Power Dis-Max:
450 W
Number of Elements:
1
Number of Terminals:
10
Operating Temperature-Max:
125 °C
Operating Temperature-Min:
-55 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
SQUARE
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity:
UNIDIRECTIONAL
Qualification Status:
Not Qualified
Rep Pk Reverse Voltage-Max:
3.3 V
Surface Mount:
YES
Technology:
AVALANCHE
Terminal Finish:
NICKEL PALLADIUM GOLD
Terminal Form:
NO LEAD
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
RCLAMP3304NATCT Frequently Asked Questions (FAQs)
A good PCB layout for the RCLAMP3304NATCT involves keeping the device close to the protected circuit, using short traces, and minimizing the inductance of the PCB traces. It's also recommended to use a solid ground plane and to keep the device away from noise sources.
The value of the external capacitor (C1) depends on the specific application and the desired level of ESD protection. A general guideline is to use a capacitor with a value between 1nF to 10nF. A larger capacitor value provides better ESD protection but increases the circuit's capacitance and may affect the signal integrity.
The RCLAMP3304NATCT is rated for operation from -40°C to 85°C. However, the device's performance and reliability may degrade at extreme temperatures. It's recommended to operate the device within the specified temperature range for optimal performance and reliability.
Yes, the RCLAMP3304NATCT is suitable for protecting high-speed data lines. It has a low capacitance of 0.4pF, which minimizes the impact on signal integrity. However, it's essential to follow proper PCB layout and design guidelines to ensure signal integrity and minimize signal degradation.
To ensure proper soldering, follow the recommended soldering profile and use a solder with a melting point below 260°C. Apply a small amount of solder paste to the PCB pads, and use a reflow oven or a hot air gun to solder the device. Avoid overheating the device or the PCB, and ensure the device is properly aligned with the PCB pads.
Trust Checks
This model has been provided by an expert contributor.
Expert Contribution
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
RCLAMP3304NATCT Overview
Use the download button to access the RCLAMP3304NATCT schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like RCLAM,
or try a keyword search, such as Transient Suppressors
