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RCR664DNP-102K - Sumida

Description: Fixed Inductors 1000uH 0.14A 10% THRU HOLE INDUCTOR

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PCB Footprints
RCR664DNP-102K - Sumida PCB footprint - Other - Other - RCR664DNP-102K-2
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3D Models
RCR664DNP-102K - Sumida  - 3D model - Other - RCR664DNP-102K-2
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RCR664DNP-102K Details

  • Manufacturer Part Number:

    RCR664DNP-102K

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Manufacturer:

    Sumida Corporation

  • YTEOL:

    6.1

  • Construction:

    Magnetically Shielded

  • DC Resistance:

    5.56 Ω

  • Inductance-Nom (L):

    1000 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Lead Diameter:

    0.5 mm

  • Lead Length:

    4 mm

  • Lead Spacing:

    4 mm

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Package Diameter:

    6 mm

  • Package Length:

    6.5 mm

  • Package Style:

    Radial

  • Rated Current-Max:

    0.14 A

  • Shape/Size Description:

    CYLINDRICAL PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    NO

  • Terminal Placement:

    RADIAL

  • Terminal Shape:

    WIRE

  • Test Frequency:

    0.001 MHz

  • Tolerance:

    10%

RCR664DNP-102K Frequently Asked Questions (FAQs)

  • A symmetrical layout with a solid ground plane and minimal track length is recommended to minimize electromagnetic interference (EMI) and ensure optimal performance.
  • While the datasheet specifies an operating temperature range of -40°C to 125°C, it's recommended to derate the component's power rating by 1.5% per degree Celsius above 100°C to ensure reliability and prevent thermal runaway.
  • To ensure reliability in high-vibration environments, it's recommended to use a secure mounting method, such as screwing or adhesive bonding, and to follow the manufacturer's recommended PCB layout and component placement guidelines.
  • A soldering profile with a peak temperature of 260°C and a dwell time of 3-5 seconds is recommended to prevent thermal damage and ensure reliable solder joints.
  • While the component is designed to operate in a variety of environments, it's recommended to apply a conformal coating or potting compound to protect the component from moisture and humidity in harsh environments.

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RCR664DNP-102K Overview

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