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RD3G01BATTL1 - ROHM Semiconductor

Description: Pch -40V -15A Power MOSFET

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PCB Footprints
RD3G01BATTL1 - ROHM Semiconductor PCB footprint - Other - Other - TO-252 (DPAK)_Master
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3D Models
RD3G01BATTL1 - ROHM Semiconductor  - 3D model - Other - TO-252 (DPAK)_Master
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RD3G01BATTL1 Details

  • Manufacturer Part Number:

    RD3G01BATTL1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DPAK-3/2

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    21 Weeks

  • Date Of Intro:

    2020-11-05

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    18 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    15 A

  • Drain-source On Resistance-Max:

    0.039 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    80 pF

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR, EMBOSSED, 13 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    25 W

  • Pulsed Drain Current-Max (IDM):

    30 A

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

RD3G01BATTL1 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a large copper area on the bottom layer connected to the thermal pad, and to use thermal vias to dissipate heat. A 2-3 layer PCB with a solid ground plane is also recommended.
  • To ensure proper power-on and power-off, it is recommended to use a soft-start circuit to limit the inrush current, and to add a power-on reset circuit to ensure the device is properly initialized.
  • To prevent ESD damage, handle the device in an ESD-controlled environment, use an anti-static wrist strap or mat, and avoid touching the device's pins or leads. Also, ensure that the device is stored in an anti-static bag or tube.
  • To troubleshoot issues, first check the power supply voltage and ensure it is within the recommended range. Then, check the input and output pins for any signs of damage or corrosion. Use an oscilloscope to check the device's output waveform and ensure it is within the expected range.
  • The recommended components for the external circuitry include a 10uF ceramic capacitor for the input filter, a 1uF ceramic capacitor for the output filter, and a 1kΩ resistor for the feedback network.

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RD3G01BATTL1 Overview

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