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RD3L03BATTL1 - ROHM Semiconductor

Description: Pch -60V -35A Power MOSFET

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PCB Footprints
RD3L03BATTL1 - ROHM Semiconductor PCB footprint - Other - Other - TO-252 (DPAK)_Master
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3D Models
RD3L03BATTL1 - ROHM Semiconductor  - 3D model - Other - TO-252 (DPAK)_Master
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RD3L03BATTL1 Details

  • Manufacturer Part Number:

    RD3L03BATTL1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DPAK-3/2

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    21 Weeks

  • Date Of Intro:

    2020-11-05

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    39 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    35 A

  • Drain-source On Resistance-Max:

    0.041 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    95 pF

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR, EMBOSSED, 13 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    56 W

  • Pulsed Drain Current-Max (IDM):

    70 A

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

RD3L03BATTL1 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal relief pattern and a solid ground plane is recommended. The device should be placed near a thermal pad or a heat sink to dissipate heat efficiently.
  • Monitor the input voltage, output voltage, and output current to ensure they are within the recommended operating ranges. Also, ensure the device is operated within the recommended temperature range of -40°C to 125°C.
  • A ceramic capacitor with a value of 4.7uF to 10uF is recommended for input decoupling. The capacitor should be placed as close to the device as possible to minimize noise and ripple.
  • The output voltage ripple and noise can be calculated using the formula: ΔVout = (Iout * Rl) / (fsw * Cout), where Iout is the output current, Rl is the load resistance, fsw is the switching frequency, and Cout is the output capacitance.
  • A ceramic capacitor with a value of 10uF to 22uF is recommended for output filtering. The capacitor should be placed as close to the device as possible to minimize noise and ripple.

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RD3L03BATTL1 Overview

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