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RE0603DRE0710KL - Yageo Group

Description: Thick Film Resistors - SMD 10 kOhms 100 mW 0603 0.5%

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RE0603DRE0710KL - Yageo Group PCB footprint - Resistor Chip - Resistor Chip - RE0603
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RE0603DRE0710KL - Yageo Group  - 3D model - Resistor Chip - RE0603
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RE0603DRE0710KL Details

  • Manufacturer Part Number:

    RE0603DRE0710KL

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    YAGEO Corporation

  • YTEOL:

    15

  • Additional Feature:

    ULTRA PRECISION, RATED AC VOLTAGE(V): 75

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    1.6 mm

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.1 W

  • Rated Temperature:

    70 °C

  • Resistance:

    10000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0603

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    50 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    0.5%

  • Working Voltage:

    75 V

RE0603DRE0710KL Frequently Asked Questions (FAQs)

  • The recommended land pattern for RE0603DRE0710KL is a rectangular pad with a size of 0.6mm x 0.3mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • Yes, RE0603DRE0710KL is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated for temperature and other environmental factors to ensure reliable operation.
  • To prevent damage, handle RE0603DRE0710KL by the edges or use a vacuum pickup tool. Avoid touching the component's termination areas, as the oils from human skin can cause soldering issues. Also, ensure that the component is not subjected to excessive mechanical stress or bending during assembly.
  • The recommended soldering profile for RE0603DRE0710KL is a peak temperature of 260°C, with a dwell time of 10-30 seconds. The soldering process should be done in a nitrogen atmosphere to prevent oxidation. It's essential to follow the manufacturer's recommended soldering profile to ensure reliable joints.
  • Yes, RE0603DRE0710KL is rated for operation in humid environments, with a moisture sensitivity level (MSL) of 1. However, it's essential to ensure that the component is properly sealed or coated to prevent moisture ingress. Additionally, the component should be stored in a dry environment to prevent moisture absorption.

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RE0603DRE0710KL Overview

Use the download button to access the RE0603DRE0710KL schematic symbol, PCB footprint, and 3D model.
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Part Image RK73G1JLTDB1002D KOA Corporation

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For a full list of alternate parts for RE0603DRE0710KL, check out Findchips.com