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RE200B - Nicera

Description: PIR SENSOR RE 200B

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PCB Footprints
RE200B - Nicera PCB footprint - Other - Other - Nicera TO-5
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3D Models
RE200B - Nicera  - 3D model - Other - Nicera TO-5
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RE200B Details

  • Manufacturer Part Number:

    RE200B

  • Part Life Cycle Code:

    Contact Manufacturer

  • Manufacturer:

    Nippon Ceramic Co Ltd

  • Body Height:

    4.5 mm

  • Body Length or Diameter:

    9.2 mm

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Operating Temperature-Max:

    70 °C

  • Operating Temperature-Min:

    -30 °C

  • Package Shape/Style:

    ROUND

  • Sensors/Transducers Type:

    LINEAR POSITION SENSOR,PHOTOELECTRIC,THROUGH BEAM

  • Supply Voltage-Max:

    15 V

  • Supply Voltage-Min:

    2.2 V

  • Surface Mount:

    NO

  • Termination Type:

    SOLDER

RE200B Frequently Asked Questions (FAQs)

  • The recommended storage condition for RE200B is in a dry, cool place, away from direct sunlight and moisture. The storage temperature should be between -20°C to 40°C, and the humidity should be below 70%.
  • Yes, RE200B can be used in high-frequency applications up to 1 GHz. However, it's essential to consider the self-resonant frequency and the impedance characteristics of the component at high frequencies.
  • RE200B is designed to operate in temperatures up to 125°C. However, the component's characteristics may change at high temperatures, and the user should consider the derating factors and temperature coefficients when designing the application.
  • Yes, RE200B is designed to withstand vibrations up to 10G. However, the user should consider the component's mechanical stress and fatigue when designing the application, especially in high-vibration environments.
  • RE200B is not recommended for use in humid or moist environments. The component's performance may degrade, and its lifespan may be reduced in such conditions. If the application requires operation in humid environments, the user should consider using a conformal coating or other environmental protection measures.

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