- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for RF1126TR7
- Part Number RF1126TR7
- Manufacturer RF Micro
- Pin Count 7
- Part Category Integrated Circuit
- Package Category Small Outline No-lead
- Footprint Name Small Outline No-lead - 6-DFN
- Released Date Apr 15, 2022
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
RF1126TR7 Details
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Manufacturer Part Number:
RF1126TR7
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Pbfree Code:
Yes
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Rohs Code:
Yes
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Part Life Cycle Code:
Transferred
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ECCN Code:
5A991.G
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HTS Code:
8541.21.00.75
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Manufacturer:
RF Micro Devices Inc
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Insertion Loss-Max:
0.5 dB
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Isolation-Min:
15 dB
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JESD-609 Code:
e4
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Mounting Feature:
SURFACE MOUNT
RF1126TR7 Frequently Asked Questions (FAQs)
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A good grounding scheme is crucial for the RF1126TR7. It is recommended to use a solid ground plane and to connect the exposed pad of the device to the ground plane. The PCB layout should also minimize the length of the signal traces and use 50-ohm impedance matching to ensure optimal performance.
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The input and output matching networks of the RF1126TR7 can be optimized using a combination of simulation tools and empirical methods. The goal is to achieve a good impedance match between the device and the external circuitry. A good starting point is to use the recommended matching networks provided in the datasheet and then fine-tune them using simulation tools such as ADS or AWR.
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The maximum power handling capability of the RF1126TR7 is dependent on the operating frequency and the specific application. However, as a general guideline, the device can handle up to 2W of continuous wave (CW) power and up to 5W of peak power for pulsed applications. It is recommended to derate the power handling capability based on the operating frequency and the specific application.
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The RF1126TR7 requires a specific biasing scheme to ensure optimal performance. The recommended biasing scheme is to use a voltage regulator to regulate the voltage supply to the device, and to use a resistor and capacitor network to set the bias voltage and current. The bias voltage and current should be set according to the recommended values provided in the datasheet.
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The RF1126TR7 can generate significant heat during operation, especially at high power levels. It is recommended to use a heat sink or a thermal pad to dissipate the heat generated by the device. The PCB layout should also be designed to minimize thermal resistance and ensure good heat flow away from the device.
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RF1126TR7 Overview
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