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RF501BGE2S - ROHM Semiconductor

Description: Super Fast Recovery Diode

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PCB Footprints
RF501BGE2S - ROHM Semiconductor PCB footprint - Other - Other - TO-252 (DPAK) Master
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3D Models
RF501BGE2S - ROHM Semiconductor  - 3D model - Other - TO-252 (DPAK) Master
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RF501BGE2S Details

  • Manufacturer Part Number:

    RF501BGE2S

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TO-252GE, 3/2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Date Of Intro:

    2020-04-10

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6

  • Application:

    SUPER FAST RECOVERY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.92 V

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    40 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Reverse Current-Max:

    1 µA

  • Reverse Recovery Time-Max:

    0.025 µs

  • Reverse Test Voltage:

    200 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
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System Verified
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RF501BGE2S Overview

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