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RF5110GSR - Qorvo

Description: RF Amplifier 150-960MHz Pout 32dBm PAE 53%

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RF5110GSR - Qorvo PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 16 pin qfn-
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RF5110GSR - Qorvo  - 3D model - Quad Flat No-Lead - 16 pin qfn-
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RF5110GSR Details

  • Manufacturer Part Number:

    RF5110GSR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    QFN-16

  • Manufacturer:

    Qorvo

  • YTEOL:

    0

  • Characteristic Impedance:

    50 Ω

  • Construction:

    COMPONENT

  • Gain:

    33 dB

  • Input Power-Max (CW):

    13 dBm

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Frequency-Max:

    960 MHz

  • Operating Frequency-Min:

    880 MHz

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Power Supplies:

    2.7/4.8 V

  • RF/Microwave Device Type:

    POWER AMPLIFIER

  • Supply Current-Max:

    2000 mA

  • Surface Mount:

    YES

  • Technology:

    HYBRID

  • Terminal Finish:

    Matte Tin (Sn)

  • VSWR-Max:

    10

RF5110GSR Frequently Asked Questions (FAQs)

  • A good PCB layout and grounding scheme is crucial for optimal performance of the RF5110GSR. It is recommended to follow a 4-layer PCB stack-up with a solid ground plane on the bottom layer, and to use a star-grounding scheme to minimize noise and radiation. Additionally, it is recommended to keep the RF traces as short as possible and to use 50-ohm microstrip lines to match the impedance of the device.
  • Optimizing the biasing and matching networks for the RF5110GSR requires careful consideration of the device's operating conditions and the application's requirements. It is recommended to use a combination of simulation tools and empirical methods to optimize the biasing and matching networks for maximum performance and efficiency.
  • The RF5110GSR is a high-power device that requires careful thermal management to ensure reliable operation. It is recommended to use a heat sink or thermal pad to dissipate heat, and to ensure good airflow around the device. The maximum junction temperature of the device should not exceed 150°C.
  • To ensure the RF5110GSR meets the required EMC and EMI standards, it is recommended to follow good design practices such as using shielding, filtering, and grounding techniques to minimize radiation and susceptibility. Additionally, it is recommended to perform EMC and EMI testing to ensure compliance with relevant standards.
  • The RF5110GSR is a high-reliability device that has undergone rigorous qualification testing. However, it is still important to consider the device's operating conditions, storage conditions, and handling procedures to ensure reliable operation over its lifetime. It is recommended to follow Qorvo's recommended storage and handling procedures to ensure the device's reliability.

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RF5110GSR Overview

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About Qorvo

Qorvo is a prominent American semiconductor company that specializes in the design and manufacturing of radio frequency (RF) solutions. The company was formed in 2015 through the merger of TriQuint Semiconductor and RF Micro Devices. Qorvo's product portfolio encompasses a wide range of RF components and semiconductor technologies used in various applications, including wireless communications, aerospace and defense, and IoT (Internet of Things) devices.

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