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RFN2LAM6STFTR - ROHM Semiconductor

Description: Automotive Fast Recovery Diode (AEC-Q101 Qualified)

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RFN2LAM6STFTR - ROHM Semiconductor - PCB symbol
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PCB Footprints
RFN2LAM6STFTR - ROHM Semiconductor PCB footprint - Other - Other - RFN2LAM6STFTR-1
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3D Models
RFN2LAM6STFTR - ROHM Semiconductor - 3D model - Other - RFN2LAM6STFTR-1
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RFN2LAM6STFTR Details

  • Manufacturer Part Number:

    RFN2LAM6STFTR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOD-128, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    9

  • Application:

    SUPER FAST RECOVERY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.55 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    40 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    1.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    1 µA

  • Reverse Recovery Time-Max:

    0.035 µs

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

RFN2LAM6STFTR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the RF signal traces short and away from noisy digital signals. Use a common mode filter or a ferrite bead to reduce EMI.
  • Ensure good thermal conductivity by using a thermal pad or a heat sink. Keep the device away from heat sources and ensure good airflow. Monitor the device temperature using a thermocouple or a thermal sensor.
  • Power up the device in the following sequence: VCC, then VDD, and finally the RF input signal. This ensures proper biasing and prevents damage to the device.
  • Use a spectrum analyzer or a vector network analyzer to measure the RF signal. Check for signal attenuation, distortion, or reflections. Verify the PCB layout and ensure proper termination and impedance matching.
  • Store the device in a dry, cool place away from direct sunlight. Handle the device by the body, avoiding touching the pins. Use an anti-static wrist strap or mat to prevent ESD damage.

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RFN2LAM6STFTR Overview

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