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RFUH20NS3STL - ROHM Semiconductor

Description: Fast Recovery Diode

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RFUH20NS3STL - ROHM Semiconductor - PCB symbol
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RFUH20NS3STL - ROHM Semiconductor PCB footprint - Other - Other - LPDS_Master
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RFUH20NS3STL - ROHM Semiconductor - 3D model - Other - LPDS_Master
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RFUH20NS3STL Details

  • Manufacturer Part Number:

    RFUH20NS3STL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TO-263S, 3/2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    7

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.5 V

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    20 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Rep Pk Reverse Voltage-Max:

    350 V

  • Reverse Recovery Time-Max:

    0.025 µs

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

RFUH20NS3STL Frequently Asked Questions (FAQs)

  • ROHM recommends a 4-layer PCB with a solid ground plane, and to keep the signal traces as short as possible. Additionally, it's essential to follow the recommended land pattern and pad layout to ensure proper heat dissipation and minimize parasitic inductance.
  • The RFUH20NS3STL requires a bias voltage of 3.3V to 5V, and a bias current of 10mA to 20mA. Ensure that the bias voltage is stable and noise-free, and that the bias current is within the recommended range to achieve optimal performance.
  • The RFUH20NS3STL is designed to operate up to 2.7 GHz, making it suitable for a wide range of wireless communication applications, including Wi-Fi, Bluetooth, and cellular networks.
  • The RFUH20NS3STL has a thermal pad on the bottom of the package, which should be connected to a solid ground plane or a thermal via to ensure proper heat dissipation. Additionally, ensure that the PCB is designed to dissipate heat efficiently, and consider using thermal interface materials or heat sinks if necessary.
  • The RFUH20NS3STL is a sensitive electronic component and should be stored in a dry, cool place, away from direct sunlight and moisture. Handle the component by the edges, avoid touching the pins, and use anti-static wrist straps or mats to prevent electrostatic discharge damage.

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RFUH20NS3STL Overview

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