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RG2012P-5491-B-T5 - Susumu

Description: https://www.digikey.com/en/products/detail/susumu/RG2012P-5491-B-T5/1240790

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PCB Footprints
RG2012P-5491-B-T5 - Susumu PCB footprint - Resistor Chip - Resistor Chip - RG2012 0805
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RG2012P-5491-B-T5 - Susumu  - 3D model - Resistor Chip - RG2012 0805
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RG2012P-5491-B-T5 Details

  • Manufacturer Part Number:

    RG2012P-5491-B-T5

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    Susumu Co Ltd

  • YTEOL:

    11

  • Additional Feature:

    ANTI-SULFUR, HIGH PRECISION

  • Construction:

    Rectangular

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.4 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    5490 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    0.1%

  • Working Voltage:

    150 V

RG2012P-5491-B-T5 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the RG2012P-5491-B-T5 is a rectangular pad with a size of 1.2mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solderable finish.
  • The RG2012P-5491-B-T5 has a thermal resistance of 35°C/W. To ensure proper thermal management, it is recommended to use a thermal pad or a heat sink with a thermal interface material (TIM) to dissipate heat. The component should be placed on a thick copper layer or a thermal via to improve heat dissipation.
  • The RG2012P-5491-B-T5 has an operating temperature range of -55°C to 150°C. However, the component's performance and reliability may degrade if operated at extreme temperatures for an extended period.
  • The RG2012P-5491-B-T5 is designed to withstand moderate vibration levels. However, it is recommended to use a vibration-dampening material or a mechanical fastening system to secure the component in high-vibration environments.
  • To ensure proper soldering, use a soldering iron with a temperature range of 250°C to 270°C. Apply a small amount of solder paste to the pads, and use a reflow oven or a hot air gun to solder the component. Avoid overheating the component, as it may damage the internal structure.

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RG2012P-5491-B-T5 Overview

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Image Part Number Model
Part Image MRG2012P-5491-B-T5 Susumu Co Ltd

Fixed Resistor, Thin Film, 0.1W, 5490ohm, 150V, 0.1% +/-Tol, 25ppm/Cel, Surface Mount, 0805, CHIP

Part Image NRG2012P-5491-W-T1 Susumu Co Ltd

Fixed Resistor, Thin Film, 0.125W, 5490ohm, 150V, 0.05% +/-Tol, 25ppm/Cel, Surface Mount, 0805, CHIP