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RG3216P-2004-B-T5 - Susumu

Description: Thin Film Resistors - SMD 1/4W 2.2M Ohm 0.1% AEC Q200 Qualified

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PCB Footprints
RG3216P-2004-B-T5 - Susumu PCB footprint - Resistor Chip - Resistor Chip - HRG3216-11
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3D Models
RG3216P-2004-B-T5 - Susumu  - 3D model - Resistor Chip - HRG3216-11
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RG3216P-2004-B-T5 Details

  • Manufacturer Part Number:

    RG3216P-2004-B-T5

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    Susumu Co Ltd

  • YTEOL:

    10

  • Additional Feature:

    ANTI-SULFUR, HIGH PRECISION

  • Construction:

    Rectangular

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.4 mm

  • Package Length:

    3.2 mm

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, EMBOSSED, 7 INCH

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    85 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    2000000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    0.1%

  • Working Voltage:

    200 V

RG3216P-2004-B-T5 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the RG3216P-2004-B-T5 can be found in the Susumu Co Ltd's application note or by contacting their technical support. A general guideline is to follow the IPC-7351 standard for QFN packages.
  • The thermal pad should be connected to a solid ground plane on the PCB to ensure optimal thermal performance. A thermal via array can be used to dissipate heat efficiently. Consult the datasheet and application notes for specific guidance.
  • The maximum operating temperature range for the RG3216P-2004-B-T5 is -40°C to 125°C. However, it's essential to check the derating curves in the datasheet to ensure the device operates within the recommended specifications.
  • The RG3216P-2004-B-T5 is designed to withstand moderate vibration levels. However, for high-vibration environments, it's recommended to consult with Susumu Co Ltd's technical support to discuss specific requirements and potential customizations.
  • The recommended soldering profile for the RG3216P-2004-B-T5 follows the IPC-J-STD-020 standard. A peak temperature of 260°C (500°F) and a dwell time of 10-30 seconds are recommended. Consult the datasheet and application notes for specific guidance.

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RG3216P-2004-B-T5 Overview

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Part Image RG3216P-2004-W-T5 Susumu Co Ltd

Fixed Resistor, Thin Film, 0.25W, 2e+06ohm, 200V, 0.05% +/-Tol, 25ppm/Cel, Surface Mount, 1206, CHIP