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RGF1A-E3/67A - Vishay

Description: Vishay RGF1A-E3/67A SMT Switching Diode, 50V 1A, 2-Pin DO-214BA

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RGF1A-E3/67A - Vishay PCB footprint - Diodes Moulded - Diodes Moulded - GF1 (DO-214BA)_1
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RGF1A-E3/67A - Vishay  - 3D model - Diodes Moulded - GF1 (DO-214BA)_1
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RGF1A-E3/67A Details

  • Manufacturer Part Number:

    RGF1A-E3/67A

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6.07

  • Additional Feature:

    FREE WHEELING DIODE, HIGH RELIABILITY, LOW LEAKAGE CURRENT

  • Application:

    EFFICIENCY

  • Breakdown Voltage-Min:

    50 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.3 V

  • JEDEC-95 Code:

    DO-214BA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    250

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    50 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.15 µs

  • Reverse Test Voltage:

    50 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

RGF1A-E3/67A Frequently Asked Questions (FAQs)

  • Vishay provides a recommended PCB layout and land pattern in their application note AN10364, which can be found on their website. It's essential to follow these guidelines to ensure proper thermal performance and to prevent thermal runaway.
  • The choice of TIM depends on the specific application and operating conditions. Vishay recommends using a TIM with a thermal conductivity of at least 1 W/m-K and a thickness of 0.05 mm to 0.1 mm. Some popular TIM options include thermal grease, thermal tape, or graphite sheets.
  • The maximum allowed Tj for the RGF1A-E3/67A is 150°C. However, it's recommended to keep the Tj below 125°C for optimal performance and reliability.
  • Yes, the RGF1A-E3/67A is designed to withstand vibrations up to 10 G. However, it's essential to ensure that the device is properly secured to the PCB and that the PCB is designed to withstand the vibrations.
  • Handle the device by the body, avoiding touching the leads or the thermal pad. Store the devices in their original packaging or in a dry, ESD-protected environment. Avoid bending or flexing the leads, and ensure that the devices are not exposed to moisture or extreme temperatures.

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RGF1A-E3/67A Overview

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For a full list of alternate parts for RGF1A-E3/67A, check out Findchips.com