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RGF1G - onsemi

Description: Easy pick and place. ; High current capability. ; For surface mounted application. ; Glass passivated junction. ; High surge current capability.; Low forward voltage drop. ; These Devices are Pb−Free and are RoHS Compliant; NRV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable

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PCB Footprints
RGF1G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMA*/
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3D Models
RGF1G - onsemi  - 3D model - Diodes Moulded - SMA*/
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RGF1G Details

  • Manufacturer Part Number:

    RGF1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMA

  • Manufacturer Package Code:

    403AE

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    6.19

  • Application:

    FAST RECOVERY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.3 V

  • JEDEC-95 Code:

    DO-214AC

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    1.76 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    400 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.15 µs

  • Reverse Test Voltage:

    400 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

RGF1G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal relief pattern and a solid ground plane is recommended. The thermal pad should be connected to a large copper area to dissipate heat efficiently.
  • The RGF1G requires a bias voltage of 2.5V to 5.5V. Ensure the bias voltage is stable and noise-free, and that the input signal is within the recommended range of 0V to VCC.
  • The maximum power dissipation of the RGF1G is 1.4W. Ensure the device is properly heat-sinked and the ambient temperature is within the recommended range of -40°C to 125°C.
  • Handle the RGF1G with an anti-static wrist strap or mat, and ensure the PCB is designed with ESD protection in mind, such as using ESD diodes or resistors.
  • The RGF1G is designed to operate from DC to 6 GHz. However, the optimal frequency range depends on the specific application and requirements.

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RGF1G Overview

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