RH-1205D - RECOM Power

RH-1205D Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  RECOM recommends a PCB layout with a large copper area connected to the module's thermal pad to ensure good heat dissipation. A minimum of 2 oz copper thickness is recommended, and the copper area should be connected to a heat sink or a metal plate for further heat dissipation.
• Can I use the RH-1205D in a high-vibration environment?
  Yes, the RH-1205D is designed to withstand high-vibration environments. However, it's recommended to follow the recommended PCB layout and mounting guidelines to ensure the module is securely attached to the PCB. Additionally, the module's connectors should be securely fastened to prevent damage or disconnection.
• What is the maximum capacitance load that the RH-1205D can handle?
  The RH-1205D can handle a maximum capacitance load of 47uF. Exceeding this value may cause the module to oscillate or become unstable. It's recommended to consult with RECOM's application engineers for specific capacitance load requirements.
• Can I use the RH-1205D in a humid or wet environment?
  The RH-1205D is designed to operate in a dry environment. While it can withstand some humidity, it's not recommended to use the module in a wet or humid environment. If the module is exposed to moisture, it may lead to corrosion or electrical failures.
• What is the recommended input fuse rating for the RH-1205D?
  RECOM recommends using a fuse with a rating of 1A to 2A, depending on the specific application and input voltage. The fuse should be able to handle the maximum input current of the module, which is 2.5A.