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RHRG1560CC_F085 - onsemi

Description: Diode Switching 600V 15A 3-Pin TO-247 Rail

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RHRG1560CC_F085 Details

  • Manufacturer Part Number:

    RHRG1560CC_F085

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    R-PSFM-T3

  • Reach Compliance Code:

    Not Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    HYPERFAST SOFT RECOVERY

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    2.3 V

  • JEDEC-95 Code:

    TO-247AB

  • JESD-30 Code:

    R-PSFM-T3

  • Non-rep Pk Forward Current-Max:

    45 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    7.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    100 µA

  • Reverse Recovery Time-Max:

    0.055 µs

  • Surface Mount:

    NO

  • Technology:

    AVALANCHE

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

RHRG1560CC_F085 Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to use a 2-ounce copper pour on the top and bottom layers, with thermal vias connecting the two layers. This helps to dissipate heat efficiently. Additionally, it's recommended to keep the PCB layout symmetrical and avoid routing high-frequency signals near the device.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal management practices. This includes providing adequate heat sinking, using a thermally conductive material for the PCB, and ensuring good airflow around the device. Additionally, consider derating the device's power handling capabilities according to the temperature derating curve provided in the datasheet.
  • The recommended soldering conditions for the RHRG1560CC-F085 are a peak temperature of 260°C (500°F) for a maximum of 10 seconds, with a soldering iron temperature of 350°C (662°F). It's also recommended to use a solder with a melting point of 217°C (423°F) or higher.
  • To handle ESD protection during handling and assembly, it's recommended to follow standard ESD precautions, such as using an ESD wrist strap, ESD mat, or ESD-safe packaging materials. Additionally, ensure that all equipment and tools used during assembly are ESD-safe and properly grounded.
  • The recommended storage and handling conditions for the RHRG1560CC-F085 are to store the devices in their original packaging, in a dry, cool place, away from direct sunlight and moisture. Avoid exposing the devices to mechanical stress, vibration, or extreme temperatures.

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RHRG1560CC_F085 Overview

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Part Image RHRG1560CC-F085 onsemi

Hyperfast Dual Diode, 600 V, 15 A, 1.86 V, TO-247, TO-247 3L, 450-TUBE, Automotive Qualified