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RHRG5060-F085 - onsemi

Description: High Speed Switching ( trr=45ns(Typ.) @ IF=50A ); Low Forward Voltage( VF=1.67V(Typ.) @ IF=50A ); Avalanche Energy Rated; AEC-Q101 Qualified

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PCB Footprints
RHRG5060-F085 - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO−247−2LD CASE 340CL ISSUE A
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3D Models
RHRG5060-F085 - onsemi  - 3D model - Transistor Outline, Vertical - TO−247−2LD CASE 340CL ISSUE A
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RHRG5060-F085 Details

  • Manufacturer Part Number:

    RHRG5060-F085

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-247 2L

  • Manufacturer Package Code:

    340CL

  • Reach Compliance Code:

    Not Compliant

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.02

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    HYPERFAST SOFT RECOVERY POWER

  • Breakdown Voltage-Min:

    600 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON NITRIDE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    2.1 V

  • JEDEC-95 Code:

    TO-247AB

  • JESD-30 Code:

    R-PSFM-T2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    150 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    50 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    250 µA

  • Reverse Recovery Time-Max:

    0.06 µs

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    NO

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

RHRG5060-F085 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal relief pattern and a solid ground plane is recommended. The device should be placed near a thermal pad or a heat sink to ensure good heat dissipation.
  • The device requires a stable input voltage and a proper biasing circuit to ensure optimal performance. A voltage regulator and a bias resistor network can be used to achieve this.
  • The maximum allowable power dissipation for RHRG5060-F085 is 2.5W. Exceeding this limit can cause the device to overheat and reduce its lifespan.
  • Yes, RHRG5060-F085 is designed for high-reliability applications. It has a high MTBF (Mean Time Between Failures) and is qualified to automotive and industrial standards.
  • ESD protection devices such as TVS diodes and zener diodes can be used to protect the RHRG5060-F085 from electrostatic discharge and overvoltage. A voltage clamp circuit can also be used to limit the input voltage.

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RHRG5060-F085 Overview

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