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RHRP1560 - onsemi

Description: Avalanche Energy Rated; 600V Reverse Voltage and High Reliability; Max Forward Voltage, VF = 2.1V (@ TC = 25°C); Hyperfast recovery Trr = 40ns (@IF= 15A); RoHS compliant

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RHRP1560 - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - RHRP1560
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RHRP1560 - onsemi  - 3D model - Transistor Outline, Vertical - RHRP1560
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RHRP1560 Details

  • Manufacturer Part Number:

    RHRP1560

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-220-2

  • Manufacturer Package Code:

    340BA

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    HYPERFAST SOFT RECOVERY

  • Breakdown Voltage-Min:

    600 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    2.1 V

  • JEDEC-95 Code:

    TO-220AC

  • JESD-30 Code:

    R-PSFM-T2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    200 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    15 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Dissipation-Max:

    100 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    100 µA

  • Reverse Recovery Time-Max:

    0.04 µs

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    NO

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

RHRP1560 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to ensure good heat dissipation.
  • Ensure proper heat sinking, use a thermal interface material (TIM) between the device and heat sink, and follow the recommended PCB layout guidelines. Also, consider derating the device's power handling at high temperatures.
  • The SOA is typically defined by the device's voltage, current, and power ratings. For the RHRP1560, the SOA is limited by the maximum voltage rating (Vds) of 600V, maximum current rating (Id) of 15A, and maximum power rating (Pd) of 150W.
  • Use a robust EOS/ESD protection scheme, including TVS diodes, resistors, and capacitors. Ensure proper PCB layout and follow onsemi's recommended EOS/ESD protection guidelines.
  • A non-inverting gate drive circuit with a gate resistor (Rg) of 10-20 ohms and a gate-source voltage (Vgs) of 10-15V is recommended. A gate driver IC with a high current capability (e.g., onsemi's FAN5350) can also be used.

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RHRP1560 Overview

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