RHV2-2405S/R20 - RECOM Power

RHV2-2405S/R20 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  RECOM recommends a PCB layout with a large copper area connected to the module's thermal pad to ensure good heat dissipation. A minimum of 2 oz copper thickness is recommended, and the copper area should be connected to a heat sink or a metal plate for further heat dissipation.
• Can I use this module in a high-vibration environment?
  Yes, the RHV2-2405S/R20 is designed to withstand high vibrations. It is compliant with IEC 60068-2-6, which specifies vibration testing for electrical components. However, it's recommended to consult with RECOM's application engineers to ensure the module is properly mounted and secured to withstand the specific vibration levels in your application.
• How do I ensure the module's reliability in high-temperature environments?
  To ensure reliability in high-temperature environments, it's essential to follow RECOM's derating guidelines for temperature. The module's output power should be derated by 2.5% per degree Celsius above 40°C. Additionally, ensure good airflow around the module, and consider using a heat sink or a metal plate to dissipate heat.
• What is the recommended input capacitor value and type for this module?
  RECOM recommends using a low-ESR input capacitor with a value of 10-22 μF, X7R or X5R dielectric, and a voltage rating of 50-100 V. The capacitor should be placed as close as possible to the module's input pins to minimize noise and ensure stable operation.
• Can I parallel multiple RHV2-2405S/R20 modules to increase output power?
  Yes, multiple RHV2-2405S/R20 modules can be paralleled to increase output power. However, it's essential to ensure that the modules are identical and have the same output voltage and current ratings. Additionally, a current-sharing scheme should be implemented to ensure equal current distribution among the paralleled modules.