RHV3-1212S/R20 - RECOM Power

RHV3-1212S/R20 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  RECOM recommends a PCB layout with a large copper area connected to the module's thermal pad to ensure good heat dissipation. A minimum of 2 oz copper thickness is recommended, and the copper area should be connected to a heat sink or a metal plate for further heat dissipation.
• Can I use this module in a high-vibration environment?
  Yes, the RHV3-1212S/R20 is designed to withstand high vibrations. It is compliant with IEC 60068-2-6, which specifies the vibration test for electrical components. However, it's recommended to consult with RECOM's application engineers to ensure the module meets the specific vibration requirements of your application.
• How do I ensure the module's reliability in high-temperature environments?
  To ensure reliability in high-temperature environments, it's essential to follow RECOM's derating guidelines for temperature. The module's output power should be derated by 2.5% per degree Celsius above 40°C. Additionally, ensure good airflow around the module, and consider using a heat sink or a metal plate to dissipate heat.
• What is the recommended input capacitor value and type for this module?
  RECOM recommends using a low-ESR ceramic capacitor with a value of 10-22 μF, X7R or X5R dielectric, and a voltage rating of 50-100 V. The capacitor should be placed as close as possible to the module's input pins to minimize noise and ensure stable operation.
• Can I use this module in a redundant configuration for high-reliability applications?
  Yes, the RHV3-1212S/R20 can be used in a redundant configuration to achieve high reliability. RECOM recommends using a redundant architecture with diode ORing or active ORing to ensure that the output voltage remains stable even if one module fails. Consult with RECOM's application engineers for more information on redundant configuration design.