RECOM recommends a PCB layout with a large copper area connected to the module's thermal pad to ensure good heat dissipation. A minimum of 2 oz copper thickness is recommended, and the copper area should be connected to a heat sink or a metal plate for further heat dissipation.
Yes, the RHV3-2405S/R20 is designed to withstand high vibrations. It meets the IEC 60068-2-6 standard for vibration resistance, which includes sinusoidal vibration testing at 10-2000 Hz, 2 mm amplitude, and 10 G acceleration.
To ensure reliability in high-temperature environments, RECOM recommends derating the module's output power according to the temperature derating curve provided in the datasheet. Additionally, ensure good airflow around the module, and consider using a heat sink or thermal interface material to improve heat dissipation.
RECOM recommends using a low-ESR input capacitor with a minimum capacitance of 10 μF and a voltage rating of at least 50 V. A ceramic or film capacitor is recommended, and it should be placed as close as possible to the module's input pins.
Yes, the RHV3-2405S/R20 can be used in a redundant or parallel configuration to achieve higher power output or redundancy. However, RECOM recommends consulting with their application engineers to ensure proper design and implementation of the redundant or parallel configuration.
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