RECOM recommends a PCB layout with a large copper area connected to the module's thermal pad to ensure good heat dissipation. A minimum of 1 oz copper thickness is recommended, and the copper area should be at least 1 inch x 1 inch in size.
Yes, the RKZ-122005D is designed to withstand high-vibration environments. However, it's essential to ensure that the module is properly secured to the PCB and that the PCB is designed to withstand the vibrations. RECOM recommends following the IPC-9592 standard for vibration testing.
To ensure reliability in high-temperature applications, RECOM recommends derating the module's output power according to the temperature derating curve provided in the datasheet. Additionally, ensure good airflow around the module, and consider using a heat sink or thermal interface material to improve heat dissipation.
RECOM recommends using a low-ESR ceramic capacitor with a value of 10-22 μF, rated for at least 50 V, as close to the module's input pins as possible. This helps to filter out input noise and ensure stable operation.
Yes, the RKZ-122005D can be used in a redundant or parallel configuration to achieve higher power output or redundancy. However, it's essential to ensure that the modules are properly synchronized and that the output voltages are matched to prevent current imbalance or oscillations.
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