The recommended land pattern for RL1220S-100-F is a rectangular pad with a size of 1.2mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape.
To ensure reliable operation, it's recommended to keep the ambient temperature below 85°C and provide adequate thermal relief paths on the PCB to dissipate heat generated by the resistor.
The MSL of RL1220S-100-F is level 1, which means it can withstand a maximum of 30 days in a standard ambient environment (30°C, 60% RH) before soldering.
Yes, RL1220S-100-F is suitable for high-frequency applications up to 1 GHz due to its low inductance and high-frequency characteristics.
The recommended soldering profile for RL1220S-100-F is a peak temperature of 260°C, with a dwell time of 10-30 seconds, and a cooling rate of 4°C/s.
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RL1220S-100-F Overview
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