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RLB0912-150KL - Bourns

Description: Power Inductors - Leaded 15uH 10% 1.7A

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PCB Footprints
RLB0912-150KL - Bourns PCB footprint - Other - Other - RLB0912-151KL-1
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3D Models
RLB0912-150KL - Bourns  - 3D model - Other - RLB0912-151KL-1
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RLB0912-150KL Details

  • Manufacturer Part Number:

    RLB0912-150KL

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    RADIAL LEADED

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    6.25

  • Construction:

    Tubular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.056 Ω

  • Inductance-Nom (L):

    15 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Lead Diameter:

    0.65 mm

  • Lead Spacing:

    5 mm

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Diameter:

    8.7 mm

  • Package Length:

    10 mm

  • Package Style:

    Radial

  • Packing Method:

    Bulk

  • Rated Current-Max:

    2.3 A

  • Self Resonance Frequency:

    21 MHz

  • Shape/Size Description:

    TUBULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Placement:

    RADIAL

  • Terminal Shape:

    WIRE

  • Test Frequency:

    0.001 MHz

  • Tolerance:

    10%

RLB0912-150KL Frequently Asked Questions (FAQs)

  • Bourns recommends a symmetrical PCB layout with a solid ground plane and a minimum of 2 oz copper thickness to minimize inductance and ensure optimal performance.
  • While the RLB0912-150KL is rated for operation up to 125°C, it's essential to consider the derating curves and thermal management to ensure reliable operation in high-temperature environments.
  • Bourns provides EMI filters with the RLB0912-150KL, but it's crucial to consider the system-level EMI design, including PCB layout, shielding, and component selection to meet specific application requirements.
  • Bourns recommends a reflow soldering process with a peak temperature of 260°C and a dwell time of 20-30 seconds to ensure reliable solder joints and minimize thermal stress.
  • While the RLB0912-150KL is designed to withstand moderate vibrations, it's essential to consider the specific vibration profile and ensure the component is properly secured to the PCB to prevent mechanical stress and damage.

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RLB0912-150KL Overview

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