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RLB0914-221KL - Bourns

Description: Bourns 220 μH ±10% Ferrite Leaded Inductor, Max SRF:2.4MHz, Q:20, 700mA Idc RLB

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Symbol
RLB0914-221KL - Bourns - PCB symbol
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PCB Footprints
RLB0914-221KL - Bourns PCB footprint - Other - Other - RLB0914
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3D Models
RLB0914-221KL - Bourns - 3D model - Other - RLB0914
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RLB0914-221KL Details

  • Manufacturer Part Number:

    RLB0914-221KL

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    RADIAL LEADED

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    6

  • Construction:

    Tubular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.6 Ω

  • Inductance-Nom (L):

    220 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Lead Diameter:

    0.65 mm

  • Lead Spacing:

    5 mm

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Diameter:

    8.7 mm

  • Package Length:

    12 mm

  • Package Style:

    Radial

  • Packing Method:

    Tray

  • Rated Current-Max:

    0.8 A

  • Self Resonance Frequency:

    2.4 MHz

  • Shape/Size Description:

    TUBULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Placement:

    RADIAL

  • Terminal Shape:

    WIRE

  • Test Frequency:

    0.796 MHz

  • Tolerance:

    10%

RLB0914-221KL Frequently Asked Questions (FAQs)

  • A symmetrical layout with a solid ground plane and minimal track lengths is recommended to minimize electromagnetic interference (EMI) and ensure optimal performance.
  • Ensure that the component is operated within its specified temperature range (–40°C to +125°C) and follow proper derating guidelines for high-temperature applications. Additionally, consider using a thermally conductive interface material to improve heat dissipation.
  • A reflow soldering profile with a peak temperature of 260°C and a dwell time of 20-30 seconds is recommended. Ensure that the component is soldered in a nitrogen atmosphere to prevent oxidation.
  • Yes, the RLB0914-221KL is suitable for high-frequency applications up to 1 GHz. However, ensure that the component is properly decoupled and that the PCB layout is optimized for high-frequency performance.
  • Store the components in their original packaging or in a dry, ESD-protected environment. Avoid exposing the components to moisture, extreme temperatures, or physical stress during shipping and storage.

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RLB0914-221KL Overview

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