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RLB9012-332KL - Bourns

Description: Inductor Power Wirewound 3300uH 10% 1KHz 15Q-Factor Ferrite 0.29A 9.1Ohm DCR RDL Bag

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Symbol
RLB9012-332KL - Bourns - PCB symbol
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PCB Footprints
RLB9012-332KL - Bourns PCB footprint - Other - Other - RLB9012-332KL-1
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3D Models
RLB9012-332KL - Bourns - 3D model - Other - RLB9012-332KL-1
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RLB9012-332KL Details

  • Manufacturer Part Number:

    RLB9012-332KL

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    RADIAL LEADED

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    5.7

  • Construction:

    Cylindrical

  • Core Material:

    FERRITE

  • DC Resistance:

    9.1 Ω

  • Inductance-Nom (L):

    3300 µH

  • Inductor Application:

    DC-DC CONVERTER

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Lead Diameter:

    0.65 mm

  • Lead Spacing:

    5 mm

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Diameter:

    9 mm

  • Package Length:

    12.2 mm

  • Package Style:

    Radial

  • Packing Method:

    Tray

  • Rated Current-Max:

    0.29 A

  • Self Resonance Frequency:

    0.6 MHz

  • Shape/Size Description:

    CYLINDRICAL PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin (Sn)

  • Terminal Placement:

    RADIAL

  • Terminal Shape:

    WIRE

  • Test Frequency:

    0.001 MHz

  • Tolerance:

    10%

RLB9012-332KL Frequently Asked Questions (FAQs)

  • A symmetrical layout with a central ground plane and minimal track lengths is recommended. Keep the input and output tracks separate and avoid crossing them to minimize electromagnetic interference (EMI).
  • Ensure good airflow around the component, avoid overheating nearby components, and consider using a heat sink if the device is expected to operate in high-temperature environments.
  • A reflow soldering profile with a peak temperature of 240°C to 250°C and a dwell time of 20-30 seconds is recommended. Avoid exceeding 260°C to prevent damage to the component.
  • Yes, but ensure the component is properly secured to the PCB using a suitable adhesive or mechanical fastening method to prevent damage from vibration.
  • Use a multimeter to measure voltage and current at the input and output pins. Check for signs of overheating, physical damage, or incorrect soldering. Consult the datasheet and application notes for guidance on troubleshooting specific issues.

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RLB9012-332KL Overview

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