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RLF10160T-151MR90-D - TDK

Description: Fixed Inductors RECOMMENDED ALT 810-CLF10060NIT151MD

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RLF10160T-151MR90-D - TDK PCB footprint - Inductors Precision Moulded - Inductors Precision Moulded - RLF10160T-3
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RLF10160T-151MR90-D - TDK  - 3D model - Inductors Precision Moulded - RLF10160T-3
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RLF10160T-151MR90-D Details

  • Manufacturer Part Number:

    RLF10160T-151MR90-D

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    0

  • Case/Size Code:

    4040

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.277 Ω

  • Inductance-Nom (L):

    150 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    6 mm

  • Package Length:

    10.2 mm

  • Package Style:

    SMT

  • Package Width:

    10 mm

  • Packing Method:

    TR, Embossed Plastic, 13 Inch

  • Rated Current-Max:

    0.9 A

  • Reference Standard:

    AEC-Q200

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

RLF10160T-151MR90-D Frequently Asked Questions (FAQs)

  • The recommended land pattern for RLF10160T-151MR90-D can be found in the TDK Corporation's recommended footprint document, which is usually available on their website or through their customer support. The document provides detailed information on the recommended pad size, shape, and spacing for optimal performance and reliability.
  • Thermal management is critical for the reliability and performance of RLF10160T-151MR90-D. It is recommended to use a thermal pad or a heat sink to dissipate heat away from the component. The thermal pad should be connected to a copper plane or a heat sink with a thermal conductivity of at least 1 W/m-K. Additionally, ensure that the component is placed in a well-ventilated area to prevent heat buildup.
  • The maximum operating temperature range for RLF10160T-151MR90-D is -40°C to +125°C. However, it is recommended to operate the component within the recommended temperature range of -20°C to +85°C for optimal performance and reliability.
  • RLF10160T-151MR90-D is designed to withstand moderate vibration levels. However, if the application involves high-vibration environments, it is recommended to use additional mechanical support or mounting mechanisms to ensure the component's reliability and performance. Consult with TDK Corporation's application engineers for specific guidance.
  • To ensure the reliability of RLF10160T-151MR90-D in a humid environment, it is recommended to use a conformal coating or a moisture-resistant package. Additionally, ensure that the component is stored in a dry environment with a relative humidity of less than 60% before assembly. Consult with TDK Corporation's application engineers for specific guidance on humidity-related considerations.

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RLF10160T-151MR90-D Overview

Use the download button to access the RLF10160T-151MR90-D schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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