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RLF7030T-3R3M4R1 - TDK

Description: TDK - RLF7030T-3R3M4R1 - Power Inductor (SMD), Wirewound, 3.3 µH, 4.1 A, Shielded, 4.4 A, RLF Series, 7.3mm x 6.8mm x 3.2mm

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PCB Footprints
RLF7030T-3R3M4R1 - TDK PCB footprint - Inductors Precision Moulded - Inductors Precision Moulded - RLF7030T
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RLF7030T-3R3M4R1 - TDK  - 3D model - Inductors Precision Moulded - RLF7030T
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RLF7030T-3R3M4R1 Details

  • Manufacturer Part Number:

    RLF7030T-3R3M4R1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    0

  • Case/Size Code:

    2927

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.0174 Ω

  • Inductance-Nom (L):

    3.3 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    3.2 mm

  • Package Length:

    7.3 mm

  • Package Style:

    SMT

  • Package Width:

    6.8 mm

  • Packing Method:

    TR, Embossed Plastic, 13 Inch

  • Rated Current-Max:

    4.1 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Special Feature:

    DC RESISTANCE IS MEASURED AT 20%

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

RLF7030T-3R3M4R1 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the RLF7030T-3R3M4R1 can be found in the TDK Corporation's application note or on their website. It typically includes a rectangular pad with a size of around 3.5mm x 2.5mm, with a 0.5mm gap between the pads.
  • The RLF7030T-3R3M4R1 has a maximum operating temperature of 125°C. To handle thermal considerations, ensure good airflow around the component, use a heat sink if necessary, and avoid overheating the component during soldering or rework.
  • The ESR of the RLF7030T-3R3M4R1 is not explicitly stated in the datasheet, but it can be estimated to be around 0.1-0.5 ohms based on similar inductors from TDK Corporation.
  • The RLF7030T-3R3M4R1 is suitable for high-frequency applications up to several hundred kHz. However, the inductor's performance may degrade at very high frequencies (e.g., above 1 MHz) due to its self-resonant frequency and parasitic capacitance.
  • To ensure proper soldering, use a soldering iron with a temperature of around 250-260°C, and apply a small amount of solder paste to the pads. Avoid overheating the component, and ensure the solder joints are clean and free of oxidation.

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RLF7030T-3R3M4R1 Overview

Use the download button to access the RLF7030T-3R3M4R1 schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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