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RLF7045T-100M1R9-D - TDK

Description: Fixed Inductors RECOMMENDED ALT 810-CLF7045NIT100MD

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RLF7045T-100M1R9-D - TDK PCB footprint - Inductors Precision Moulded - Inductors Precision Moulded - RLF7045T
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RLF7045T-100M1R9-D - TDK  - 3D model - Inductors Precision Moulded - RLF7045T
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RLF7045T-100M1R9-D Details

  • Manufacturer Part Number:

    RLF7045T-100M1R9-D

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    0

  • Case/Size Code:

    2927

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.05 Ω

  • Inductance-Nom (L):

    10 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    4.6 mm

  • Package Length:

    7.3 mm

  • Package Style:

    SMT

  • Package Width:

    6.8 mm

  • Packing Method:

    TR, Embossed Plastic, 13 Inch

  • Rated Current-Max:

    1.9 A

  • Reference Standard:

    AEC-Q200

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

RLF7045T-100M1R9-D Frequently Asked Questions (FAQs)

  • The recommended land pattern for RLF7045T-100M1R9-D can be found in the TDK Corporation's recommended land pattern document, which is usually available on their website or through their customer support. The document provides detailed information on the recommended pad size, shape, and spacing for optimal performance and reliability.
  • Thermal management is critical for the reliability and performance of RLF7045T-100M1R9-D. It is recommended to use a thermal pad or a heat sink to dissipate heat away from the component. The thermal pad or heat sink should be designed to provide a low thermal resistance path to the PCB or a heat sink. Additionally, the PCB should be designed with thermal vias to dissipate heat to the other side of the board or to a heat sink.
  • The maximum operating temperature range for RLF7045T-100M1R9-D is typically specified as -40°C to +125°C, but it's recommended to check the datasheet or consult with TDK Corporation's customer support for the exact temperature range, as it may vary depending on the specific application and environment.
  • To ensure the reliability of RLF7045T-100M1R9-D in high-vibration environments, it is recommended to use a robust PCB design, secure the component using a suitable adhesive or mechanical fastening, and consider using a vibration-dampening material or a shock-absorbing mount. Additionally, it's recommended to perform vibration testing and analysis to ensure the component meets the required specifications.
  • The recommended storage and handling procedure for RLF7045T-100M1R9-D includes storing the components in their original packaging, away from direct sunlight, moisture, and extreme temperatures. It's also recommended to handle the components by the edges, avoid touching the component's surface, and use anti-static wrist straps or mats to prevent electrostatic discharge.

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RLF7045T-100M1R9-D Overview

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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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