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RLF7045T-4R7N2R5-D - TDK

Description: Fixed Inductors RECOMMENDED ALT 810-CLF7045NIT4R7ND

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RLF7045T-4R7N2R5-D - TDK PCB footprint - Inductors Precision Moulded - Inductors Precision Moulded - RLF7045T-3
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3D Models
RLF7045T-4R7N2R5-D - TDK  - 3D model - Inductors Precision Moulded - RLF7045T-3
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RLF7045T-4R7N2R5-D Details

  • Manufacturer Part Number:

    RLF7045T-4R7N2R5-D

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    0

  • Case/Size Code:

    2927

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.03 Ω

  • Inductance-Nom (L):

    4.7 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    4.6 mm

  • Package Length:

    7.3 mm

  • Package Style:

    SMT

  • Package Width:

    6.8 mm

  • Packing Method:

    TR, Embossed Plastic, 13 Inch

  • Rated Current-Max:

    2.5 A

  • Reference Standard:

    AEC-Q200

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    30%

RLF7045T-4R7N2R5-D Frequently Asked Questions (FAQs)

  • The recommended land pattern for RLF7045T-4R7N2R5-D can be found in the TDK Corporation's recommended footprint document, which is usually available on their website or through their customer support. The document provides detailed information on the recommended pad size, shape, and spacing for optimal performance and reliability.
  • Thermal management is critical for the RLF7045T-4R7N2R5-D, especially in high-power applications. TDK recommends using a thermal pad or a heat sink to dissipate heat away from the component. The thermal pad should be connected to a copper plane or a heat sink with a thermal conductivity of at least 1 W/mK. Additionally, ensure that the component is placed in a well-ventilated area to prevent overheating.
  • The maximum operating temperature range for RLF7045T-4R7N2R5-D is -40°C to +125°C. However, it's essential to note that the component's performance and reliability may degrade at extreme temperatures. It's recommended to operate the component within the recommended temperature range specified in the datasheet for optimal performance.
  • Yes, RLF7045T-4R7N2R5-D is designed to withstand high-vibration environments. However, it's essential to ensure that the component is properly mounted and secured to the PCB to prevent mechanical stress and damage. TDK recommends following the recommended mounting and soldering guidelines to ensure the component's reliability in high-vibration applications.
  • To troubleshoot issues with RLF7045T-4R7N2R5-D, start by checking the component's soldering and mounting. Ensure that the component is properly soldered and mounted to the PCB. Next, verify that the component is operating within the recommended voltage and current ratings. If the issue persists, consult the datasheet and application notes for troubleshooting guidelines or contact TDK's customer support for assistance.

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RLF7045T-4R7N2R5-D Overview

Use the download button to access the RLF7045T-4R7N2R5-D schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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