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RLP73K3AR30FTDF - TE Connectivity

Description: Configuration Features: Number of Resistors 1 | Dimensions: Product Height .029 INCH | Product Length .25 INCH | Product Length 6.35 MM | Product Width 3.15 MM | Product Width .124 INCH | Product Height .74 MM | Electrical Characteristics: Passive Component Tolerance 1 PCT | Resistance Class Up to 1kΩ | Resistance Value .3 OHM | Power Rating 2 WATT | Packaging Features: Packaging Method Taped & Reeled | Product Type Features: Resistor Type Current Sensing Resistor | Element Type Thick Film | Package Size C

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RLP73K3AR30FTDF - TE Connectivity - PCB symbol
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PCB Footprints
RLP73K3AR30FTDF - TE Connectivity PCB footprint - Resistor Chip - Resistor Chip - RLP73K
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RLP73K3AR30FTDF - TE Connectivity - 3D model - Resistor Chip - RLP73K
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RLP73K3AR30FTDF Details

  • Manufacturer Part Number:

    RLP73K3AR30FTDF

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    TE Connectivity

  • YTEOL:

    10

  • Construction:

    Rectangular

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.74 mm

  • Package Length:

    6.35 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    3.15 mm

  • Packing Method:

    TR

  • Physical Dimension:

    6.35mm x 3.15mm x .74mm

  • Rated Power Dissipation (P):

    2 W

  • Resistance:

    0.3 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    2512

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    200 ppm/°C

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

RLP73K3AR30FTDF Frequently Asked Questions (FAQs)

  • TE Connectivity provides a recommended PCB layout and land pattern in their application notes or design guides. It's essential to follow these guidelines to ensure proper soldering and to prevent thermal and mechanical stress on the component.
  • TE Connectivity recommends handling the component by the body or the terminals, avoiding touching the resistor element or the ceramic substrate. During rework, use a low-temperature soldering iron and a solder with a low melting point to prevent thermal shock.
  • The maximum power rating of the RLP73K3AR30FTDF decreases as the operating temperature increases. Consult the derating curve in the datasheet or contact TE Connectivity for specific information on power rating at high temperatures.
  • The RLP73K3AR30FTDF is designed to withstand certain levels of vibration and shock. However, it's essential to consult TE Connectivity's reliability and environmental testing data to ensure the component meets the specific requirements of your application.
  • The RLP73K3AR30FTDF is classified as a moisture-sensitive device. Follow the recommended storage and handling procedures, and ensure that the component is properly packaged and sealed to prevent moisture absorption.

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RLP73K3AR30FTDF Overview

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About TE Connectivity

TE Connectivity, a global leader in connectivity and sensor solutions, designs and manufactures products that enable a more connected world. Serving a diverse range of industries, including automotive, industrial, medical, aerospace, and telecommunications, TE Connectivity offers a broad portfolio of products such as connectors, sensors, relays, and passive components. The company's innovations help improve the reliability and performance of electronic systems.

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