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RLP73N1ER33JTD - TE Connectivity

Description: Configuration Features: Number of Resistors 1 | Dimensions: Product Height .013 INCH | Product Length .039 INCH | Product Height .32 MM | Product Length 1 MM | Product Width .5 MM | Product Width .02 INCH | Electrical Characteristics: Power Rating .125 WATT | Resistance Value .33 OHM | Passive Component Tolerance 5 PCT | Resistance Class Up to 1kΩ | Packaging Features: Packaging Method Taped & Reeled | Product Type Features: Resistor Type Low Ohmic Resistor | Element Type Thick Film | Package Size Code 040

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PCB Footprints
RLP73N1ER33JTD - TE Connectivity PCB footprint - Resistor Chip - Resistor Chip - 1x0.5mm_2022
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RLP73N1ER33JTD - TE Connectivity  - 3D model - Resistor Chip - 1x0.5mm_2022
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RLP73N1ER33JTD Details

  • Manufacturer Part Number:

    RLP73N1ER33JTD

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    14 Weeks, 3 Days

  • Manufacturer:

    TE Connectivity

  • YTEOL:

    12

  • Construction:

    Rectangular

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.32 mm

  • Package Length:

    1 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR

  • Physical Dimension:

    1mm x .5mm x .2mm

  • Rated Power Dissipation (P):

    0.125 W

  • Resistance:

    0.33 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0402

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    300 ppm/°C

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    5%

RLP73N1ER33JTD Frequently Asked Questions (FAQs)

  • TE Connectivity provides a recommended PCB layout and land pattern in their application notes or design guides. It's essential to follow these guidelines to ensure proper soldering and to prevent thermal and mechanical stress on the component.
  • Proper thermal management is crucial for the reliability and performance of RLP73N1ER33JTD. Ensure good airflow, use thermal vias, and consider heat sinks or thermal pads to dissipate heat. Consult TE Connectivity's thermal management guidelines for specific recommendations.
  • While the datasheet provides a recommended operating temperature range, it's essential to note that the maximum operating temperature range may be lower than the maximum storage temperature range. Consult TE Connectivity's documentation or contact their support team for specific guidance.
  • RLP73N1ER33JTD is designed to meet specific vibration and shock requirements. However, it's crucial to evaluate the component's performance in your specific application. Consult TE Connectivity's documentation or contact their support team to determine the component's suitability for your use case.
  • To ensure reliability and quality, follow TE Connectivity's recommended design and manufacturing guidelines, use proper soldering techniques, and implement adequate testing and inspection procedures. Additionally, consider using components from authorized distributors to prevent counterfeit parts.

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RLP73N1ER33JTD Overview

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About TE Connectivity

TE Connectivity, a global leader in connectivity and sensor solutions, designs and manufactures products that enable a more connected world. Serving a diverse range of industries, including automotive, industrial, medical, aerospace, and telecommunications, TE Connectivity offers a broad portfolio of products such as connectors, sensors, relays, and passive components. The company's innovations help improve the reliability and performance of electronic systems.

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