RLS-105 - RECOM Power

RLS-105 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  RECOM recommends a PCB layout with a large copper area connected to the module's thermal pad to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended, and the copper area should be connected to a heat sink or a metal plate for further heat dissipation.
• How do I ensure the module's reliability in high-temperature environments?
  To ensure reliability in high-temperature environments, RECOM recommends derating the module's output power according to the temperature derating curve provided in the datasheet. Additionally, ensuring good airflow and using a heat sink can help to reduce the module's operating temperature.
• What is the recommended input capacitor type and value for the RLS-105?
  RECOM recommends using a low-ESR ceramic capacitor with a value of 10-22 μF, X7R or X5R dielectric, and a voltage rating of 50-100 V. The capacitor should be placed as close as possible to the module's input pins to minimize noise and ripple.
• Can I use the RLS-105 in a redundant or parallel configuration?
  Yes, the RLS-105 can be used in a redundant or parallel configuration to achieve higher output power or redundancy. However, RECOM recommends consulting with their application engineers to ensure proper design and implementation of the configuration.
• What is the typical MTBF (Mean Time Between Failures) of the RLS-105?
  The typical MTBF of the RLS-105 is >1 million hours, calculated according to MIL-HDBK-217F. However, the actual MTBF may vary depending on the operating conditions, temperature, and other factors.