RLS-186 - RECOM Power

RLS-186 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  RECOM recommends a PCB layout with a large copper area connected to the module's thermal pad to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended, and the copper area should be connected to a heat sink or a metal plate for further heat dissipation.
• How do I ensure the module's reliability in high-temperature environments?
  To ensure reliability in high-temperature environments, RECOM recommends derating the module's output power according to the temperature derating curve provided in the datasheet. Additionally, ensuring good airflow and using a heat sink can help to reduce the module's operating temperature.
• What is the recommended input capacitor type and value for this module?
  RECOM recommends using a low-ESR ceramic capacitor with a value of 10-22 μF and a voltage rating of at least 50 V. The capacitor should be placed as close as possible to the module's input pins to minimize noise and ripple.
• Can I use this module in a redundant or parallel configuration?
  Yes, the RLS-186 can be used in a redundant or parallel configuration to achieve higher output power or redundancy. However, RECOM recommends consulting with their application engineers to ensure proper design and implementation of the redundant or parallel configuration.
• What is the module's behavior during input voltage brownout or dropout?
  The RLS-186 module will shut down during an input voltage brownout or dropout and will restart automatically when the input voltage returns to a safe operating level. The module's undervoltage lockout (UVLO) feature ensures that the module does not operate during low input voltage conditions.