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RM2012B-102/102-PBVW10 - Susumu

Description: Resistor Networks & Arrays 1K/1K 25V

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PCB Footprints
RM2012B-102/102-PBVW10 - Susumu PCB footprint - Other - Other - RM2012B_2023
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3D Models
RM2012B-102/102-PBVW10 - Susumu  - 3D model - Other - RM2012B_2023
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RM2012B-102/102-PBVW10 Details

  • Manufacturer Part Number:

    RM2012B-102/102-PBVW10

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.20

  • Manufacturer:

    Susumu Co Ltd

  • YTEOL:

    9

  • Construction:

    Rectangular

  • Element Power Dissipation:

    0.05 W

  • First Element Resistance:

    1000 Ω

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Network Type:

    ISOLATED

  • Number of Elements:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, EMBOSSED, 7 INCH

  • Rated Power Dissipation (P):

    0.1 W

  • Rated Temperature:

    85 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    1000 Ω

  • Resistor Type:

    ARRAY/NETWORK RESISTOR

  • Second/Last Element Resistance:

    1000 Ω

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Temperature Coefficient:

    25 ppm/°C

  • Temperature Coefficient Tracking:

    5 ppm/°C

  • Terminal Finish:

    MATTE TIN

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    0.1%

  • Working Voltage:

    10 V

RM2012B-102/102-PBVW10 Frequently Asked Questions (FAQs)

  • The recommended land pattern for RM2012B-102/102-PBVW10 is a rectangular pad with a size of 2.5mm x 1.25mm, with a non-solder mask defined (NSMD) pad shape.
  • Yes, RM2012B-102/102-PBVW10 is rated for operation up to 150°C, making it suitable for high-temperature applications. However, derating may be necessary for prolonged exposure to high temperatures.
  • Handle the RM2012B-102/102-PBVW10 by the edges to prevent damage to the component. Avoid touching the component's leads or body to prevent electrostatic discharge (ESD) damage.
  • The recommended soldering profile for RM2012B-102/102-PBVW10 is a peak temperature of 260°C, with a dwell time of 10-30 seconds. A soldering iron with a temperature range of 200-250°C is recommended.
  • Yes, RM2012B-102/102-PBVW10 is compatible with lead-free soldering. However, the recommended soldering profile may vary depending on the specific lead-free solder alloy used.

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RM2012B-102/102-PBVW10 Overview

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