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RMCF0603FT107K - Stackpole Electronics, Inc.

Description: RES, 0603, 107 Kohm, 1%, 0.1W

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RMCF0603FT107K - Stackpole Electronics, Inc. - PCB symbol
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RMCF0603FT107K - Stackpole Electronics, Inc. PCB footprint - Resistor Chip - Resistor Chip - RMCF0603
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RMCF0603FT107K - Stackpole Electronics, Inc. - 3D model - Resistor Chip - RMCF0603
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RMCF0603FT107K Details

  • Manufacturer Part Number:

    RMCF0603FT107K

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    SEI Stackpole Electronics Inc

  • YTEOL:

    13

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    1.55 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.1 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    107000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0603

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    75 V

RMCF0603FT107K Frequently Asked Questions (FAQs)

  • The recommended land pattern for RMCF0603FT107K is a rectangular pad with a size of 0.6mm x 0.3mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a clearance of at least 0.1mm from the component body.
  • The thermal derating of RMCF0603FT107K should be handled by reducing the power rating of the component as the ambient temperature increases. The datasheet provides a thermal derating curve that shows the maximum power rating at different temperatures. Engineers should ensure that the component is operated within the recommended power rating to prevent overheating and ensure reliability.
  • The MSL of RMCF0603FT107K is 1, which means it can withstand a maximum of 30°C/60%RH for 192 hours. This means that the component can be stored in a dry environment and can be reflowed multiple times without being exposed to moisture.
  • Yes, RMCF0603FT107K can be used in high-frequency applications up to 1 GHz. However, the component's impedance and parasitic effects should be considered in the design to ensure optimal performance. Engineers should also ensure that the component is properly decoupled and that the PCB layout is optimized for high-frequency operation.
  • To ensure the reliability of RMCF0603FT107K in harsh environments, engineers should follow proper design and manufacturing practices, such as using a robust PCB design, ensuring proper component mounting and soldering, and using conformal coating or potting to protect the component from environmental stresses.

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RMCF0603FT107K Overview

Use the download button to access the RMCF0603FT107K schematic symbol, PCB footprint, and 3D model.
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Part Image NRC-AS06F1073TRF NIC Components Corp

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Part Image CR-03FLD--107K Viking Tech Corp

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Part Image CRCW0603107KFKEB Vishay Intertechnologies

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