The recommended land pattern for RMCF0603FT1M13 is a rectangular pad with a size of 0.6mm x 0.3mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
Yes, RMCF0603FT1M13 is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the component's power rating should be derated according to the temperature derating curve provided in the datasheet.
RMCF0603FT1M13 is a moisture-sensitive device (MSD) and should be stored in a dry environment with a relative humidity of less than 30%. If the component is exposed to moisture, it should be baked in a dry oven at 125°C for 24 hours before reflow soldering.
The recommended reflow soldering profile for RMCF0603FT1M13 is a peak temperature of 260°C, with a dwell time above 220°C of 30-60 seconds. The ramp rate should be 3°C/second or less, and the cooling rate should be 6°C/second or less.
Yes, RMCF0603FT1M13 is AEC-Q200 qualified, which means it meets the requirements for automotive applications. However, the component should be used in accordance with the datasheet and applicable automotive industry standards.
Trust Checks
This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
RMCF0603FT1M13 Overview
Use the download button to access the RMCF0603FT1M13 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like RMCF0,
or try a keyword search, such as Metal Glaze/Thick Film Resistors
