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RMCF0603JG22K0 - Stackpole Electronics, Inc.

Description: RES, 0603, 10K 22 Kohm, 5%, 0.1W

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RMCF0603JG22K0 - Stackpole Electronics, Inc. - PCB symbol
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PCB Footprints
RMCF0603JG22K0 - Stackpole Electronics, Inc. PCB footprint - Resistor Chip - Resistor Chip - RMCF0603
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3D Models
RMCF0603JG22K0 - Stackpole Electronics, Inc. - 3D model - Resistor Chip - RMCF0603
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RMCF0603JG22K0 Details

  • Manufacturer Part Number:

    RMCF0603JG22K0

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    SEI Stackpole Electronics Inc

  • YTEOL:

    13

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    1.55 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, Paper, 10 Inch

  • Rated Power Dissipation (P):

    0.1 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    22000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0603

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    5%

  • Working Voltage:

    75 V

RMCF0603JG22K0 Frequently Asked Questions (FAQs)

  • The recommended land pattern for RMCF0603JG22K0 is a rectangular pad with a size of 0.6mm x 0.3mm, with a non-solder mask defined (NSMD) pad shape. The land pattern should be designed to accommodate the component's termination style and ensure reliable soldering.
  • RMCF0603JG22K0 is rated for operation up to 150°C, but it's recommended to derate the component's power rating at higher temperatures. For applications above 125°C, consult with the manufacturer or a qualified engineer to ensure the component's reliability and performance.
  • RMCF0603JG22K0 is a moisture-sensitive device (MSD) and requires proper handling and storage to prevent damage. Follow the manufacturer's guidelines for handling and storage, and ensure that the component is baked according to the recommended schedule before reflow soldering.
  • The recommended soldering profile for RMCF0603JG22K0 is a reflow profile with a peak temperature of 260°C, a dwell time above 220°C of 20-30 seconds, and a cooling rate of 3-5°C/second. Consult the manufacturer's guidelines for specific soldering profile recommendations.
  • RMCF0603JG22K0 is designed for general-purpose applications and may not be suitable for high-vibration or high-shock environments. Consult with the manufacturer or a qualified engineer to determine the component's suitability for specific applications and to discuss potential modifications or alternative components.

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RMCF0603JG22K0 Overview

Use the download button to access the RMCF0603JG22K0 schematic symbol, PCB footprint, and 3D model.
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