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RMCF0805FT3K09 - Stackpole Electronics, Inc.

Description: RES, 0805, 3.09 Kohm, 1%, 0.125W

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RMCF0805FT3K09 - Stackpole Electronics, Inc. - PCB symbol
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PCB Footprints
RMCF0805FT3K09 - Stackpole Electronics, Inc. PCB footprint - Resistor Chip - Resistor Chip - RCMP0805
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3D Models
RMCF0805FT3K09 - Stackpole Electronics, Inc. - 3D model - Resistor Chip - RCMP0805
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RMCF0805FT3K09 Details

  • Manufacturer Part Number:

    RMCF0805FT3K09

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    SEI Stackpole Electronics Inc

  • YTEOL:

    12

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.5 mm

  • Package Length:

    2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.125 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    3090 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    150 V

RMCF0805FT3K09 Frequently Asked Questions (FAQs)

  • The recommended land pattern for RMCF0805FT3K09 is a rectangular pad with a size of 1.2mm x 1.4mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
  • Yes, RMCF0805FT3K09 is suitable for high-frequency applications up to 1 GHz due to its low equivalent series resistance (ESR) and high self-resonant frequency (SRF). However, it's essential to consider the PCB layout and parasitic effects to minimize signal degradation.
  • RMCF0805FT3K09 is rated for operation up to 150°C, but its performance may degrade at higher temperatures. The capacitance value may decrease, and the ESR may increase. It's crucial to consider the operating temperature range and derate the component accordingly.
  • Yes, RMCF0805FT3K09 is compatible with lead-free soldering processes, including RoHS and WEEE compliance. The component is designed to withstand the higher temperatures associated with lead-free soldering.
  • RMCF0805FT3K09 should be stored in a dry, cool place with a relative humidity of 60% or less, and at a temperature range of -10°C to 40°C. Avoid exposing the component to direct sunlight, moisture, or extreme temperatures.

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RMCF0805FT3K09 Overview

Use the download button to access the RMCF0805FT3K09 schematic symbol, PCB footprint, and 3D model.
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Part Image CR0805-10W-3091FSNT-13 VENKEL LTD

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