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RMCF1206FG1M21 - Stackpole Electronics, Inc.

Description: RES, 1206, 1.21 Mohm, 1%, 0.25W

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PCB Footprints
RMCF1206FG1M21 - Stackpole Electronics, Inc. PCB footprint - Resistor Chip - Resistor Chip - RMCF1206
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3D Models
RMCF1206FG1M21 - Stackpole Electronics, Inc.  - 3D model - Resistor Chip - RMCF1206
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RMCF1206FG1M21 Details

  • Manufacturer Part Number:

    RMCF1206FG1M21

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    SEI Stackpole Electronics Inc

  • YTEOL:

    12

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    3.2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, Paper, 10 Inch

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    1210000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    200 V

RMCF1206FG1M21 Frequently Asked Questions (FAQs)

  • The recommended land pattern for RMCF1206FG1M21 is a rectangular pad with a size of 1.3mm x 1.3mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • Yes, RMCF1206FG1M21 is suitable for high-frequency applications up to 1 GHz. However, it's essential to consider the self-resonant frequency (SRF) of the component, which is around 2.5 GHz, and ensure that the operating frequency is below the SRF to avoid resonance issues.
  • RMCF1206FG1M21 is rated for operation up to 150°C. However, the component's impedance and Q-factor may degrade at high temperatures. It's recommended to derate the component's specifications by 1% for every 10°C above 125°C to ensure reliable operation.
  • Yes, RMCF1206FG1M21 is compatible with lead-free soldering processes, including SAC305 and Sn96.5Ag3Cu0.5. However, it's essential to follow the recommended soldering profile and ensure that the peak temperature does not exceed 260°C.
  • RMCF1206FG1M21 should be stored in a dry, cool place with a relative humidity of 60% or less and a temperature range of -10°C to 40°C. It's recommended to store the components in their original packaging or in a sealed bag to prevent moisture absorption.

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RMCF1206FG1M21 Overview

Use the download button to access the RMCF1206FG1M21 schematic symbol, PCB footprint, and 3D model.
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Part Image CRA1206T200V1.21M+/-1% Precision Resistive Products Inc

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Part Image RC1206F1214-07-T70 Taitron Components Inc

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Part Image NRCL12F1214TR10F NIC Components Corp

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For a full list of alternate parts for RMCF1206FG1M21, check out Findchips.com