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RMCF1206FT10K0 - Stackpole Electronics, Inc.

Description: RES, 1206, 10 Kohm, 1%, 0.25W

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PCB Footprints
RMCF1206FT10K0 - Stackpole Electronics, Inc. PCB footprint - Resistor Chip - Resistor Chip - RMCF1206
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3D Models
RMCF1206FT10K0 - Stackpole Electronics, Inc.  - 3D model - Resistor Chip - RMCF1206
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RMCF1206FT10K0 Details

  • Manufacturer Part Number:

    RMCF1206FT10K0

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    SEI Stackpole Electronics Inc

  • YTEOL:

    12

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    3.2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    10000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    200 V

RMCF1206FT10K0 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the RMCF1206FT10K0 is a rectangular pad with a size of 1.5mm x 3.5mm, with a non-solder mask defined (NSMD) pad shape.
  • The RMCF1206FT10K0 is rated for operation up to 150°C, but it's recommended to derate the power rating by 1.5% per degree Celsius above 125°C to ensure reliable operation.
  • The RMCF1206FT10K0 is a lead-free component and should be soldered using a lead-free soldering process. The recommended soldering temperature is 260°C for 10 seconds or less.
  • The RMCF1206FT10K0 has a moisture sensitivity level (MSL) of 3, which means it can be exposed to a relative humidity of 60% or less at 30°C for up to 168 hours without damage.
  • The RMCF1206FT10K0 is designed to withstand vibrations up to 10G, but it's recommended to secure the component using a suitable adhesive or mechanical fastening to prevent movement during operation.

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RMCF1206FT10K0 Overview

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Part Image RC1206FRF1310KL YAGEO Corporation

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Part Image SR12X1002FTLW Walsin Technology Corporation

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Part Image PWR06FWGO1002A Viking Tech Corp

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Part Image HASG06FVEV1002A Hitano Enterprise Corp

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For a full list of alternate parts for RMCF1206FT10K0, check out Findchips.com