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RMCF1206FT12K0 - Stackpole Electronics, Inc.

Description: RES, 1206, 12 Kohm, 1%, 0.25W

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RMCF1206FT12K0 - Stackpole Electronics, Inc. - PCB symbol
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PCB Footprints
RMCF1206FT12K0 - Stackpole Electronics, Inc. PCB footprint - Resistor Chip - Resistor Chip - RMCF1206
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3D Models
RMCF1206FT12K0 - Stackpole Electronics, Inc. - 3D model - Resistor Chip - RMCF1206
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RMCF1206FT12K0 Details

  • Manufacturer Part Number:

    RMCF1206FT12K0

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    SEI Stackpole Electronics Inc

  • YTEOL:

    12

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    3.2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    12000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    200 V

RMCF1206FT12K0 Frequently Asked Questions (FAQs)

  • The recommended land pattern for RMCF1206FT12K0 is a rectangular pad with a size of 1.5mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
  • Yes, RMCF1206FT12K0 is suitable for high-frequency applications up to 1 GHz due to its low equivalent series resistance (ESR) and high self-resonant frequency (SRF). However, it's essential to consider the PCB layout and parasitic effects to minimize signal degradation.
  • RMCF1206FT12K0 is rated for operation up to 150°C, but its performance may degrade at higher temperatures. The capacitance value may decrease, and the ESR may increase. It's essential to consider the operating temperature range and derate the component accordingly.
  • Yes, RMCF1206FT12K0 is compatible with lead-free soldering processes, including RoHS and WEEE compliance. The component is designed to withstand the higher temperatures associated with lead-free soldering.
  • RMCF1206FT12K0 should be stored in a dry, cool place with a relative humidity of 60% or less. The storage temperature should be between -20°C and 40°C. Avoid exposing the component to direct sunlight, moisture, or extreme temperatures.

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RMCF1206FT12K0 Overview

Use the download button to access the RMCF1206FT12K0 schematic symbol, PCB footprint, and 3D model.
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