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RMCF1206FT4M70 - Stackpole Electronics, Inc.

Description: RES, 1206, 4.7 Mohm, 1%, 0.25W

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RMCF1206FT4M70 - Stackpole Electronics, Inc. - PCB symbol
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PCB Footprints
RMCF1206FT4M70 - Stackpole Electronics, Inc. PCB footprint - Resistor Chip - Resistor Chip - RMCF1206
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3D Models
RMCF1206FT4M70 - Stackpole Electronics, Inc. - 3D model - Resistor Chip - RMCF1206
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RMCF1206FT4M70 Details

  • Manufacturer Part Number:

    RMCF1206FT4M70

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    SEI Stackpole Electronics Inc

  • YTEOL:

    12

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    3.2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    4700000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    200 V

RMCF1206FT4M70 Frequently Asked Questions (FAQs)

  • The recommended land pattern for RMCF1206FT4M70 is a rectangular pad with a size of 1.5mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
  • Yes, RMCF1206FT4M70 is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated to prevent overheating and premature failure.
  • To prevent damage during PCB assembly, handle the RMCF1206FT4M70 by the edges, avoid touching the component's surface, and use anti-static wrist straps or mats to prevent electrostatic discharge (ESD).
  • The recommended soldering profile for RMCF1206FT4M70 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. This ensures proper solder wetting and minimizes the risk of component damage.
  • Yes, RMCF1206FT4M70 is designed to withstand high-vibration and high-shock environments. However, it's essential to ensure that the component is properly secured to the PCB using a suitable adhesive or mechanical fastening method.

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RMCF1206FT4M70 Overview

Use the download button to access the RMCF1206FT4M70 schematic symbol, PCB footprint, and 3D model.
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