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RMCF1206FT6R80 - Stackpole Electronics, Inc.

Description: 6.8 Ohms ±1% 0.25W, 1/4W Chip Resistor 1206 (3216 Metric) Automotive AEC-Q200 Thick Film

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RMCF1206FT6R80 - Stackpole Electronics, Inc. PCB footprint - Resistor Chip - Resistor Chip - 1206 (3216 Metric)_2024
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RMCF1206FT6R80 - Stackpole Electronics, Inc.  - 3D model - Resistor Chip - 1206 (3216 Metric)_2024
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RMCF1206FT6R80 Details

  • Manufacturer Part Number:

    RMCF1206FT6R80

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    SEI Stackpole Electronics Inc

  • YTEOL:

    12

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    3.2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    6.8 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    200 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    200 V

RMCF1206FT6R80 Frequently Asked Questions (FAQs)

  • The recommended land pattern for RMCF1206FT6R80 is a rectangular pad with a size of 1.5mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and thermal management.
  • Yes, RMCF1206FT6R80 is suitable for high-frequency applications up to 1 GHz due to its low equivalent series resistance (ESR) and high self-resonant frequency (SRF). However, it's essential to consider the PCB layout and parasitic effects to minimize signal degradation.
  • To handle thermal derating, ensure that the operating temperature of RMCF1206FT6R80 does not exceed 125°C. Use a thermal management strategy such as heat sinks, thermal vias, or air flow to keep the component temperature within the specified range.
  • Yes, RMCF1206FT6R80 is compatible with lead-free soldering processes, including RoHS and WEEE directives. The component is designed to withstand the higher temperatures associated with lead-free soldering.
  • Store RMCF1206FT6R80 in a dry, cool place with a temperature range of 10°C to 30°C and relative humidity below 60%. Avoid exposing the component to direct sunlight, moisture, or extreme temperatures.

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RMCF1206FT6R80 Overview

Use the download button to access the RMCF1206FT6R80 schematic symbol, PCB footprint, and 3D model.
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Part Image SG73P2BLTDD6R80F KOA Speer Electronics Inc

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For a full list of alternate parts for RMCF1206FT6R80, check out Findchips.com