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RMCF1206ZT0R00 - Stackpole Electronics, Inc.

Description: RES, 1206, Jumper

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RMCF1206ZT0R00 - Stackpole Electronics, Inc. - PCB symbol
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PCB Footprints
RMCF1206ZT0R00 - Stackpole Electronics, Inc. PCB footprint - Resistor Chip - Resistor Chip - RMCF1206
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3D Models
RMCF1206ZT0R00 - Stackpole Electronics, Inc. - 3D model - Resistor Chip - RMCF1206
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RMCF1206ZT0R00 Details

  • Manufacturer Part Number:

    RMCF1206ZT0R00

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    SEI Stackpole Electronics Inc

  • YTEOL:

    11

  • Additional Feature:

    RATED CURRENT: 2A

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    3.2 mm

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistor Type:

    JUMPER

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

RMCF1206ZT0R00 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the RMCF1206ZT0R00 is a rectangular pad with a size of 1.5mm x 3.5mm, with a non-solder mask defined (NSMD) pad shape.
  • To handle thermal considerations, ensure good thermal conduction by using a thermal via or a thermal pad under the component. Also, consider using a thermal interface material (TIM) to improve heat transfer.
  • The maximum operating temperature range for the RMCF1206ZT0R00 is -55°C to 150°C, but it's recommended to operate within -40°C to 125°C for optimal performance.
  • To ensure proper soldering, use a soldering iron with a temperature range of 250°C to 270°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes thermal shock and ensures good wetting of the solder.
  • Store the RMCF1206ZT0R00 in a dry, cool place, away from direct sunlight and moisture. The recommended storage temperature range is 5°C to 30°C, with a relative humidity of 60% or less.

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RMCF1206ZT0R00 Overview

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RMCF1206ZT0R00 Alternates

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Part Image RMC1/8JPTP Kamaya Inc

Metal Glaze/thick Film, 0.25W, 0ohm, Surface Mount, 1206
Part Image CR-06JLD----0RAC Viking Tech Corp

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Part Image ASC1206-R000T5 TT Electronics Welwyn Components

JUMPER, 0.25W, 0ohm, SURFACE MOUNT, 1206, CHIP, ROHS COMPLIANT
Part Image RMCF1206ZB0R00 SEI Stackpole Electronics Inc

Metal Glaze/thick Film, 0.25W, 0ohm, Surface Mount, 1206
Part Image RCM3216J000AS Samsung Electro-Mechanics

Fixed Resistor, Metal Glaze/thick Film, 0.05ohm, 1206,
For a full list of alternate parts for RMCF1206ZT0R00, check out Findchips.com