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RMCF1210FT200R - Stackpole Electronics, Inc.

Description: RES, 1210, 200 ohm, 1%, 0.5W

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RMCF1210FT200R - Stackpole Electronics, Inc. - PCB symbol
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RMCF1210FT200R - Stackpole Electronics, Inc. PCB footprint - Resistor Chip - Resistor Chip - RMCF1210
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RMCF1210FT200R - Stackpole Electronics, Inc. - 3D model - Resistor Chip - RMCF1210
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RMCF1210FT200R Details

  • Manufacturer Part Number:

    RMCF1210FT200R

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    SEI Stackpole Electronics Inc

  • YTEOL:

    12

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    3.2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    2.5 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.5 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    200 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1210

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    200 V

RMCF1210FT200R Frequently Asked Questions (FAQs)

  • The recommended land pattern for the RMCF1210FT200R is a rectangular pad with a size of 1.3mm x 1.3mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • During reflow soldering, the RMCF1210FT200R should be placed on a flat, even surface to prevent warping or damage. The component should be aligned with the PCB pads and secured with a gentle pressure. The recommended reflow profile is a peak temperature of 260°C with a dwell time of 20-30 seconds.
  • The RMCF1210FT200R has an operating temperature range of -55°C to +155°C, making it suitable for use in a wide range of applications, including automotive, industrial, and aerospace.
  • Yes, the RMCF1210FT200R is compatible with lead-free soldering and is RoHS compliant. It is designed to meet the requirements of the European Union's Restriction of Hazardous Substances (RoHS) directive.
  • The RMCF1210FT200R should be stored in a dry, cool place, away from direct sunlight and moisture. It should be handled with care to prevent mechanical damage, and electrostatic discharge (ESD) precautions should be taken to prevent damage to the component.

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RMCF1210FT200R Overview

Use the download button to access the RMCF1210FT200R schematic symbol, PCB footprint, and 3D model.
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Part Image CQ07U2F2000T5E Royal Electronic Factory (Thailand) Co Ltd

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