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RMCF1210FT61R9 - Stackpole Electronics, Inc.

Description: RES, 1210, 61.9 ohm, 1%, 0.5W

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RMCF1210FT61R9 - Stackpole Electronics, Inc. - PCB symbol
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RMCF1210FT61R9 - Stackpole Electronics, Inc. PCB footprint - Resistor Chip - Resistor Chip - RMCF1210
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RMCF1210FT61R9 - Stackpole Electronics, Inc. - 3D model - Resistor Chip - RMCF1210
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RMCF1210FT61R9 Details

  • Manufacturer Part Number:

    RMCF1210FT61R9

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    SEI Stackpole Electronics Inc

  • YTEOL:

    12

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    3.2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    2.5 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.5 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    61.9 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1210

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    200 V

RMCF1210FT61R9 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the RMCF1210FT61R9 can be found in the Stackpole Electronics Inc. application note AN-040, which provides guidelines for PCB layout and land pattern design.
  • The RMCF1210FT61R9 has a high power rating, and proper thermal management is crucial. Engineers should ensure good airflow, use thermal vias, and consider using a heat sink or thermal pad to keep the component temperature within the recommended operating range.
  • The MSL of the RMCF1210FT61R9 is MSL 1, which means it can withstand a maximum of 30 days at 30°C and 60% relative humidity before soldering. Engineers should follow proper storage and handling procedures to prevent moisture absorption.
  • The RMCF1210FT61R9 is designed to withstand moderate vibration levels, but engineers should consider the specific vibration requirements of their application. Stackpole Electronics Inc. recommends consulting with their application engineers for customized vibration testing and guidance.
  • The recommended soldering profile for the RMCF1210FT61R9 is a peak temperature of 260°C for 10-15 seconds, with a ramp-up rate of 3°C/second and a ramp-down rate of 6°C/second. Engineers should consult the Stackpole Electronics Inc. soldering guide for more detailed information.

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RMCF1210FT61R9 Overview

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RMCF1210FT61R9 Alternates

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Part Image CR-10FP5--61R9 Viking Tech Corp

Fixed Resistor, Metal Glaze/thick Film, 0.5W, 61.9ohm, 200V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 1210, CHIP
Part Image RMC35K61R9FB Kamaya Inc

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Part Image FPF12FT-61R9-M Prosperity Dielectrics Co Ltd

Fixed Resistor, Metal Glaze/thick Film, 0.5W, 61.9ohm, 200V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 1210
Part Image WR10X61R9FTL Walsin Technology Corporation

Fixed Resistor, Metal Glaze/thick Film, 0.5W, 61.9ohm, 200V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 1210
Part Image RMC-2061R9FR Cinetech Industrial Co Ltd

Fixed Resistor, Metal Glaze/thick Film, 0.5W, 61.9ohm, 200V, 1% +/-Tol, -100,100ppm/Cel, 1210,
For a full list of alternate parts for RMCF1210FT61R9, check out Findchips.com