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RMCF2512FT1M00 - Stackpole Electronics, Inc.

Description: RES, 2512, 1 Mohm, 1%, 1W

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RMCF2512FT1M00 - Stackpole Electronics, Inc. - PCB symbol
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PCB Footprints
RMCF2512FT1M00 - Stackpole Electronics, Inc. PCB footprint - Resistor Chip - Resistor Chip - RMCF2512
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RMCF2512FT1M00 - Stackpole Electronics, Inc. - 3D model - Resistor Chip - RMCF2512
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RMCF2512FT1M00 Details

  • Manufacturer Part Number:

    RMCF2512FT1M00

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    SEI Stackpole Electronics Inc

  • YTEOL:

    10

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    6.3 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    3.2 mm

  • Packing Method:

    TR, Plastic, 7 Inch

  • Rated Power Dissipation (P):

    1 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    1000000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    2512

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    200 V

RMCF2512FT1M00 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the RMCF2512FT1M00 is a rectangular pad with a size of 1.3mm x 2.5mm, with a non-solder mask defined (NSMD) pad shape.
  • To handle thermal considerations, ensure a good thermal connection to a heat sink or a thermal pad, and consider using thermal interface materials (TIMs) to reduce thermal resistance. Also, follow the recommended PCB layout guidelines to minimize thermal impedance.
  • The maximum operating temperature range for the RMCF2512FT1M00 is -55°C to 150°C, with a storage temperature range of -55°C to 180°C.
  • To ensure proper soldering, follow the recommended soldering profile, use a solder with a melting point below 260°C, and avoid overheating the component. Also, ensure the PCB is clean and free of oxidation.
  • The recommended power rating derating for the RMCF2512FT1M00 is to derate the power rating by 1.5% per degree Celsius above 25°C, up to a maximum operating temperature of 150°C.

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RMCF2512FT1M00 Overview

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